RFH UV laser featuring cold processing is used to cut and depanel PCB/FPC
More and more clients ask for RFH laser to cut and depanel PCB/FPC
RFH UV laser with 13-year experience can cut circuit board without burr
RFH UV laser featuring cold processing is used to cut and depanel PCB/FPC

RFH UV laser with 13-year experience can cut PCB/FPC without burr, which reduces scrap rate and cost and improves quality.

In the past few months, more and more clients ask for RFH laser to cut and depanel PCB/FPC.

For the time being, FPC laser cutting technique often adopts 355nm UV laser and the laser power ranges from 8W to 10W. The main reason why other circuit board cutting also uses 355nm UV laser is that it has exceptional laser beam quality and it is a kind of “cold light source” with little heat transfer to surrounding material. A FPC laser cutting using RFH Expert series solid-state UV laser has only 10?m heat-affecting zone. This is very helpful in improving productivity.


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